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Specialty semiconductor foundry & packaging

Design Engineers Evaluate Suppliers Before They Ever Request a Sample.

Silicon Ridge Technologies provides specialty semiconductor fabrication, advanced packaging, and test services for automotive, industrial, and IoT applications in the U.S. and beyond.

90nm-350nm Process node range
IATF 16949 Automotive certified
15 Years Fab operations

What We Do

Foundry and packaging capabilities for high-reliability applications.

Wafer Fabrication

CMOS, BCD, and specialty processes from 90nm to 350nm for analog, mixed-signal, and power ICs.

Advanced Packaging

Flip-chip, wire bond, WLCSP, and system-in-package for high-density applications.

Test & Qualification

Wafer-level and final test, reliability qualification, and failure analysis.

Automotive & Industrial

AEC-Q100 qualification, PPAP support, and zero-defect programs.

Why Silicon Ridge

Foundry quality for applications that can't fail.

Automotive Qualified

IATF 16949, AEC-Q100, and PPAP certified for safety-critical applications.

Supply Chain Resilience

US-based fabrication with dual-source material agreements and 16-week lead times.

Design Enablement

Complete PDK, design rules, and application engineering support.

Portfolio

Program snapshots from recent customer engagements.

NPI Program

Automotive Sensor Wafer Ramp

Wafer Fabrication

Qualified mixed-signal process flow with AEC-Q100 reliability gates for Tier 1 customer launch.

202495% first-pass yield
Packaging

Industrial MCU Package Migration

Advanced Packaging

Moved legacy package to WLCSP path with thermal and reliability validation for harsher environments.

202318% package cost reduction
Qualification

Power IC Reliability Qualification Program

Test & Qualification

Completed accelerated life testing and FA workflows supporting long-cycle industrial contracts.

2024Zero critical field returns

View all portfolio →

Our Team

Process experts across fab, packaging, and qualification.

Ethan M. Chou

Founder & CEO

PhD EE. Former foundry operations leader with 20+ years in specialty analog, mixed-signal, and automotive-grade process manufacturing.

Rina D. Sato

SVP, Packaging & Test

MS Materials Science. Leads advanced packaging qualification, reliability testing, and customer NPI transitions.

Meet the full team →

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