Specialty semiconductor foundry & packaging
Specialty Fabrication for High-Reliability Applications.
Silicon Ridge Technologies provides specialty semiconductor fabrication, advanced packaging, and test services for automotive, industrial, and IoT applications in the U.S. and beyond.
Reference Structure Signal
Technology platform positioning with reliability and supply-assurance themes.
Technology
Manufacturing
Customer Solutions
Sustainability
Reference HTML & CSS Framework
Engineering-first structure adapted from technical reference leaders.
The page sequence mirrors how operators validate capability: challenge framing, methods, proof of delivery, then access.
Technology
Problem-first headline and context to anchor technical relevance.
Manufacturing
Execution modules tied to lifecycle stage and project controls.
Customer Solutions
Project evidence with measurable reliability and safety outcomes.
Sustainability
Knowledge stream that reinforces practical field credibility.
Features & Format
Designed as a conversion platform, not just a brochure.
Capability-First Architecture
Organize by discipline and lifecycle stage to reduce buyer friction.
Delivery Feature Set
Surface schedule controls, quality checkpoints, and safety systems as core features.
Technical Content Format
Use concise specs, process visuals, and outcome metrics over marketing prose.
What We Do
Foundry and packaging capabilities for high-reliability applications.
Wafer Fabrication
CMOS, BCD, and specialty processes from 90nm to 350nm for analog, mixed-signal, and power ICs.
Advanced Packaging
Flip-chip, wire bond, WLCSP, and system-in-package for high-density applications.
Test & Qualification
Wafer-level and final test, reliability qualification, and failure analysis.
Automotive & Industrial
AEC-Q100 qualification, PPAP support, and zero-defect programs.
Our Team
Process experts across fab, packaging, and qualification.
Ethan M. Chou
Founder & CEO
PhD EE. Former foundry operations leader with 20+ years in specialty analog, mixed-signal, and automotive-grade process manufacturing.
Rina D. Sato
SVP, Packaging & Test
MS Materials Science. Leads advanced packaging qualification, reliability testing, and customer NPI transitions.
Portfolio
Program snapshots from recent customer engagements.
NPI Program
Automotive Sensor Wafer Ramp
Wafer Fabrication
Qualified mixed-signal process flow with AEC-Q100 reliability gates for Tier 1 customer launch.
202495% first-pass yield
Packaging
Industrial MCU Package Migration
Advanced Packaging
Moved legacy package to WLCSP path with thermal and reliability validation for harsher environments.
202318% package cost reduction
Qualification
Power IC Reliability Qualification Program
Test & Qualification
Completed accelerated life testing and FA workflows supporting long-cycle industrial contracts.
2024Zero critical field returns
Structure
Built for how this industry evaluates credibility and fit.
Operators & Owners
Teams that need schedule certainty, safety controls, and predictable delivery.
Project & Field Teams
Technical stakeholders coordinating scope, sequencing, and execution quality.
Procurement & Compliance
Leads validating standards, documentation, and vendor performance.
Why Silicon Ridge
Foundry quality for applications that can't fail.
Automotive Qualified
IATF 16949, AEC-Q100, and PPAP certified for safety-critical applications.
Supply Chain Resilience
US-based fabrication with dual-source material agreements and 16-week lead times.
Design Enablement
Complete PDK, design rules, and application engineering support.
Process capability and lead time vary by technology node, package type, and qualification requirements.