Specialty semiconductor foundry & packaging
Design Engineers Evaluate Suppliers Before They Ever Request a Sample.
Silicon Ridge Technologies provides specialty semiconductor fabrication, advanced packaging, and test services for automotive, industrial, and IoT applications in the U.S. and beyond.
What We Do
Foundry and packaging capabilities for high-reliability applications.
Wafer Fabrication
CMOS, BCD, and specialty processes from 90nm to 350nm for analog, mixed-signal, and power ICs.
Advanced Packaging
Flip-chip, wire bond, WLCSP, and system-in-package for high-density applications.
Test & Qualification
Wafer-level and final test, reliability qualification, and failure analysis.
Automotive & Industrial
AEC-Q100 qualification, PPAP support, and zero-defect programs.
Why Silicon Ridge
Foundry quality for applications that can't fail.
Automotive Qualified
IATF 16949, AEC-Q100, and PPAP certified for safety-critical applications.
Supply Chain Resilience
US-based fabrication with dual-source material agreements and 16-week lead times.
Design Enablement
Complete PDK, design rules, and application engineering support.
Portfolio
Program snapshots from recent customer engagements.
Automotive Sensor Wafer Ramp
Wafer Fabrication
Qualified mixed-signal process flow with AEC-Q100 reliability gates for Tier 1 customer launch.
Industrial MCU Package Migration
Advanced Packaging
Moved legacy package to WLCSP path with thermal and reliability validation for harsher environments.
Power IC Reliability Qualification Program
Test & Qualification
Completed accelerated life testing and FA workflows supporting long-cycle industrial contracts.
Our Team
Process experts across fab, packaging, and qualification.
Ethan M. Chou
Founder & CEO
PhD EE. Former foundry operations leader with 20+ years in specialty analog, mixed-signal, and automotive-grade process manufacturing.
Rina D. Sato
SVP, Packaging & Test
MS Materials Science. Leads advanced packaging qualification, reliability testing, and customer NPI transitions.