NPI Program
Automotive Sensor Wafer Ramp
Wafer Fabrication
Qualified mixed-signal process flow with AEC-Q100 reliability gates for Tier 1 customer launch.
202495% first-pass yield
Portfolio
Selected Projects and Outcomes
Projects and programs that demonstrate our standards for technical rigor and execution.
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Packaging
Industrial MCU Package Migration
Advanced Packaging
Moved legacy package to WLCSP path with thermal and reliability validation for harsher environments.
202318% package cost reduction
Qualification
Power IC Reliability Qualification Program
Test & Qualification
Completed accelerated life testing and FA workflows supporting long-cycle industrial contracts.
2024Zero critical field returns
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